Appendix

OBJECTIVE:
The purpose of the test was to demonstrate the capabilities of ITW Fastex^® Micro-Tuflok and Plasti-Rivets in the harsh environment of a wave soldering process.

PROCESS:
The wave solder process involves three stages. The first stage is the fluxing operation where flux is applied to the underside of the PC board. The second stage is the preheat. The PC board passes over heating elements at a temperature of 850°F. The length of time a PC board remains in this section depends on the geometry of the PC board. This test varied the cycle time from 27 seconds to 38 seconds. After the PC board exits the preheat stage, it enters the solder bath. The bottom face of the PC board is immersed in 500°F molten solder. This stage exposed the prongs of the Micro-Tuflok and Plasti-Rivet to 500°F solder for a period of 1 ½ to 2 seconds.

RESULTS:
The results of this test are favorable. The prongs of the fasteners that were immersed in solder showed signs of deformation but no failures occurred. One PC board was even sent through the process a second time without part failure.

WAVE SOLDER PROCESS

STAGE	TEMPERATURE (°F)	TIME (sec)
Preheat	850°	38 sec
Solder	500°	2 sec

Call the Fastex Sample Department for a free sample of a Micro-Tuflok holding a transistor onto a PC Board, which has gone through the wave solder process twice.

Appendix